SiCarrier Unveils Ambitious Roadmap at SEMICON China

At SEMICON China, SiCarrier announced plans to launch ASML-compatible lithography machines for 300-mm wafers by 2026. The company, working closely with domestic fabs, aims to broaden its R&D presence and service capabilities internationally. Its notable collaborations include partnerships with major Chinese foundries and involvement with Huawei.

SiCarrier made a significant impression at SEMICON China by unveiling elements of its ambitious product roadmap. The Chinese semiconductor equipment manufacturer has revealed plans to introduce lithography machines for 300-mm wafers at 28nm processes, with a target launch of an upgraded version accommodating ASML and Applied Materials technologies anticipated by 2026, as reported by anue.

According to Zhao Min, SiCarrier’s Market Director, the firm has assembled a specialized team focusing on ensuring compatibility with existing equipment utilized by domestic fabrication plants. Furthermore, Chen Dong, the Chief Technology Officer of SiCarrier, indicated that the company is collaborating with several fabrication facilities to establish joint laboratories. The expectation is to announce the first set of commercial orders by the fourth quarter of 2025.

SiCarrier has already secured prominent clients, including leading Chinese foundries SMIC and Hua Hong Group, with certain etching equipment reportedly in production for power semiconductor lines. The company aims to enhance its research and development footprint by expanding into over ten cities within the next three years and plans to set up service centers in Europe and Southeast Asia, further underlined in the report.

Founded in 2022, SiCarrier is supported by a notable leadership background, with its technology chief, Dai Jun, also holding influential positions within China’s Big Fund II and SMIC’s board. Earlier reports suggest that SiCarrier is a state-backed developer collaborating with Huawei, further positioning itself as a key player in the semiconductor equipment sector.

SiCarrier gained notable attention in 2023 for securing a patent related to the manufacture of 5nm chips utilizing DUV tools, a significant advancement associated with Huawei’s 7nm chip for the Mate 60 Pro. At SEMICON China, the firm showcased an extensive range of semiconductor manufacturing tools, including metrology and inspection apparatus, while details regarding their lithography capabilities remained undisclosed. Despite this, the company offers a comprehensive selection of tools addressing nearly every stage of front-end semiconductor production, alongside metrology, inspection, and testing resources, as noted by Tom’s Hardware.

SiCarrier is positioning itself as a key innovator in the semiconductor industry with an ambitious roadmap for lithography machines compatible with leading manufacturers. Its focus on joint collaborations, extensive research and development expansion, and strategic market positioning are set to enhance its offerings significantly. As it progresses towards the 2026 launch of its upgraded tools, SiCarrier’s integration of advanced technology highlights its growing influence in the global semiconductor landscape.

Original Source: www.trendforce.com