Weekly News Roundup: China Strengthens Chip Technology, Samsung Gains Ground

These are the most-read DIGITIMES Asia stories from the week of May 12 – May 18. From China’s push in DUV lithography and Samsung’s resurgence in foundry orders to TSMC’s aggressive fab expansion and Europe’s looming ban on Chinese inverters, the week highlighted shifting power dynamics across the global tech and semiconductor landscape.

fast_summary: The week of May 12 to May 18 saw significant developments in the semiconductor industry. China made headway in DUV lithography technology despite U.S. export restrictions, while Samsung secured a major foundry order from Nintendo. TSMC is aggressively expanding its manufacturing capabilities, and Europe considers a ban on Chinese solar inverters amid cybersecurity concerns.

article_body: In the realm of technology, particularly semiconductors, the dynamics are shifting notably. China is making strides in domestic DUV lithography despite facing tight U.S. export controls. The country has recently unveiled a 193nm dry ArF system boasting a 65nm resolution and an impressive 8nm overlay accuracy, with plans to hopefully see it operational by September 2024. Yet, it still lags when measured against international standards. The Chinese Academy of Sciences and Beijing RSLaser are at the forefront of research into immersion DUV technology, with rumors suggesting that SMEE might have produced a 28nm immersion prototype that remains unconfirmed and unready for production. Such developments indicate China’s ongoing ambitions for semiconductor independence, though there remains a considerable distance to travel in achieving advanced lithography maturity.

Samsung Electronics has also made headlines by securing an important 8nm foundry order from Nintendo, specifically for the anticipated Switch 2 console. This is engineered to produce around 15 million units in fiscal 2025 and will utilize an Nvidia Tegra SoC. This order could be the first step toward further contracts with tech giants Nvidia and Qualcomm, who are, incidentally, assessing Samsung’s 2nm GAA process in conjunction with TSMC’s offerings. Current yield rates for Samsung’s 2nm process are between 40 to 50 percent, but the company aims for a 60 percent target for large-scale production. Meanwhile, a resurgence in the activity of idle production lines hints at plans for a full production ramp-up by late 2025.

In conclusion, the semiconductor industry continues to evolve, as seen in the recent advances made by China in DUV lithography, Samsung’s foundry orders which pave the way for collaborations with leading tech companies, and TSMC’s ambitious expansion plans to produce more AI chips. Additionally, Europe faces crucial decisions regarding the security risks associated with Chinese solar technology. All these movements reflect the ongoing battle for dominance in the global tech sector, with implications for future production and international relations.

Original Source: www.digitimes.com